AI Chip Boom Shifts Bottleneck to Advanced Packaging, AT&S CEO Warns
AI News Brief: AT&S CEO warns that the global AI wave is creating new bottlenecks in semiconductor manufacturing, as advanced packaging services and substrate supply can no longer keep up with demand. Michael Mertin, CEO of the Austrian substrate supplier, points out that AI chips have dramatically increased the complexity of supply chain partnerships, and vendors and customers can no longer operate on simple order-and-delivery terms but must collaborate, think together, and build joint technology roadmaps, reflecting how advanced packaging is shifting from a relatively standardized foundry model toward a deeper, more tightly coupled cooperative structure that requires both sides to jointly plan capacity and technology evolution. To address AI demand continuously outpacing substrate capacity, AT&S is expanding its operations in Penang, Malaysia, signaling that advanced packaging and substrate capacity have become the new bottleneck segment following semiconductor manufacturing in the AI chip supply chain. The original summary does not provide further details on expansion scale, investment amount, or timeline; please refer to the original link for full details.